Small diameter lead-free solder wire Sn96.5Ag3.0Cu0.5

Lead-free solder wire:
1.active rosin cored flux from 1.8% to 3.3%.
2.strong early wetting rate,good durative.
3.SGS report
Small diameter lead-free solder wire Sn96.5Ag3.0Cu0.5





Shape & tolerance:lead-free solder wire(tin silder wire)
Appearance: lucent, no dirt on surface
Weight: 15KG/box or so
Features: made of pure tin and pure copper from Yunnan Tin Industry Co., Ltd., advanced processing with high purity .
Purpose: leadless soldering in high temperature for electronics industry
Physical properties:
(1) Liquid temperature: about 227
(2) Specific gravity: about 7.4

Alloy composition:(0.16mm solder wire)
Tin (Sn)
Ag
Cuprum (Cu)
Plumbum (Pb)
Stibium (Sb)
Bismuth (Bi)
Zincum (Zn)
Ferrum (Fe)
Aluminum (Al)
Arsenic (As)
Cadmium (Cd)
96.5
3.0
0.5±0.2
<0.1
<0.02
<0.01
<0.02
<0.02
<0.02
<0.03
<0.02
Physical properties
Spec.(colophony content) Melting point Specific gravity (g/cm2)
1.1% 227 7.38
2.2% 227 7.34
3.3% 227 7.40

Lead-free solder wire is suitable for the static dip soldering and welding wire soldering and hand-holding dip slodering.Solder wire is widely used on electronic industry.