No-clean Solder Wire

No-clean Solder Wire
High activity, fast soldering, low fume, low odour, low spattering
No-clean Solder Wire

Contain very effective activators. Wet and spread like RA yet leave virtually no post-soldering residues, resulting in a visibly clean solder connection.

M type (no halogen) and ML type (with halogen) no-clean tin wire, which are manufactured by high-tech multi-element formula, reach tin wire standard for SJ/T11168-98 no-clean braze welding. It is of reliable welding spot, cleanness, nice appearance, high insulation resistance after welding, low ion pollution, and little residue of PCB plate after welding, etc, and suitable for no-clean technique standard of high-precision high-performance electronic products. Our company provides no-clean tin wires with various tin contents and linear diameters for clients.


High activity
Fast soldering
Low fume
Low odour
Low spattering
Object
M
ML
Halogen content
0
<=0.3
Flux content
0.5-1.5
0.5-1.5
Spreading
>=80
>=80
Acidity KOHmg/g
<220
<=150

Standard Wire Diameters

x
Diameter (inch)
0.125
0.092
0.062
0.050
0.040
0.031
0.025
0.020


Diameter (mm)

3.18
2.33
1.57
1.27
1.01
0.80
0.63
0.50


Standard Wire Gauge
11
13
16
18
19
21
23
25