Lower temperature lead-free solder wire Sn96.5Ag3.0Cu0.5

lead-free solder wire Sn96.5Ag3.0Cu0.5:
1.suitable for the static dip soldering
2.with no clean for repairing through-hole
lead-free solder wire Sn96.5Ag3.0Cu0.5 used on electronics,telecom industry,lighting industry and other industry.
Yunan tin solder areof high reptation in home and abroad markets.
Shape & tolerance: wire
Appearance: lucent, no dirt on surface
Weight: 15KG/box or so
Features: made of pure tin and pure copper from Yunnan Tin Industry Co., Ltd., advanced processing with high purity .
Purpose: leadless soldering in high temperature for electronics industry
Physical properties:
(1) Liquid temperature: about 227
(2) Specific gravity: about 7.4
Alloy composition:(lead solder alloy)
Tin (Sn)
Cuprum (Cu)
Plumbum (Pb)
Stibium (Sb)
Bismuth (Bi)
Zincum (Zn)
Ferrum (Fe)
Aluminum (Al)
Arsenic (As)
Cadmium (Cd)
99.3
0.7±0.2
<0.1
<0.02
<0.01
<0.02
<0.02
<0.02
<0.03
<0.02
Physical properties
Spec.(colophony content) Melting point Specific gravity (g/cm2)
1.1% 227 7.38
2.2% 227 7.34
3.3% 227 7.40