tin solder wire and bar are based on tin, lead free alloy are compliant to ROHS regulation.
lead-free solder wires:
Spec
Melting
point
Tensile strength
Extensibility
Rate of spread
Usage
Sn100
232
20
43
70
Electroplating anode bar
Sn-Cu0.7
227
30
45
70
Lower cost, high melting point, poor wetting, low caplillarity, poor fatigue property, can be used for low requirements soldering.
Sn-Ag3.5
222
38
54
75
Higher cost,
SnAg3.0Cu0.5
217
40
58
78
Higer cost, good performance, first choice by most of factories.
SnAg0.3Cu0.5
SnAg3.5Cu0.7
Tin lead solder wire
Sn60Pb40, Sn63Pb37, Sn55Pb45, Sn50Pb50, Sn45Pb55, Sn40Pb60, Sn35Pb65, Sn30Pb70, Sn25P75
No comments:
Post a Comment